Aluminium basierte runde LED PWB-Versammlung

Spezifikationen 1. Angebot Probe \ n2.UL, SGS, Rohs CE \ n3.OEM & ODM PCB und PCBA \ n4.Hohe Qualität \ n5.Schnelle Lieferung \ n \ n Aluminium basierte Runde LED Platine \ n \ n MOKO Service einschließlich: \ n \ n 1.PCB \ n 2.Komponenten-Service \ n 3.PCB-Assembly / OEM-Service \ n 4.PCBA-Test \ n \ n \ n PCB Technische Spezifikation \ n \ n

Number of Layer	1,2,4 or 6,upto 18 layer
Order Quantity	1 to 50,000
Board Shape	Retangular,round,slots,cutouts,complex,irregular
Board Type	Rigid, Flexible, Rigid-flexible
Board Material	FR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc.
Board Cutting	Shear,V-score,Tab-routed
Board Thickness	0.2-4.0mm, Flex 0.01-0.25mm
Copper Weight	1.0, 1.5, 2.0 oz
Solder Mask	Double-sided green LPI,Also support Red,White,Yellow,Blue,Black
Silk Screen	Double-sided or single-sided in white,yellow,black,or negative
Silk Screen Min Line Width	0.006'' or 0.15mm
Max Board Dimensions	20 inch*20inch or 500mm*500mm
Min Trace/Gap	0.10mm, or 4mils
Min Drill Hole Diameter	0.01'',0.25mm, or 10mils
Surface Finish	HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc.
Board Thickness Tolerance	±10%
Copper Weight Tolerance	± 0.25 oz
Minimal Slot Width	0.12'', 3.0mm, or 120mils
V-Score Depth	20-25% of board thickness
Design File Formate	Gerber RS-274,274D,Eagle and AutoCAD's DXF,DWG

\ n \ n \ n PCBA-Fähigkeiten \ n

Quantity	Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000
Type of Assembly	SMT,Thru-hole
Solder Type	Water Soluble Solder Paste,Leaded and Lead-Free
Components	Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement
Bare Board Size	Smallest:0.25*0.25 inches Largest:20*20 inches
File Formate	Bill of Materials Gerber files Pick-N-Place file
Types of Service	Turn-key,partial turn-key or consignment
Component packaging	Cut Tape,Tube,Reels,Loose Parts
Turn Time	Same day service to 15 days service
Testing	Flying Probe Test,X-ray Inspection AOI Test
PCB assembly process	Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

\ n Technische Voraussetzung für Leiterplattenbestückung: \ n \ n1. Professionelle Aufputz- und Durchstecklöttechnik \ n2. Verschiedene Größen wie 1206,0805,0603 Komponenten SMT-Technologie \ n3.ICT (In Circuit Test), FCT (Funktionsprüfung) -Technologie. \ N4.PCB Montage mit UL, CE, FCC, Rohs-Genehmigung \ n5.Nitrogen Gas Reflow-Löten Technologie für SMT. \ n6.Hohe Standard-SMT- und Löt-Fertigungslinie \ n7. Mit hoher Kapazität verbundene Technologiekapazität der verbundenen Leiterplatte. \ N \ n Zitatanforderung für PWB- und PWB-Versammlung: \ n \ n1. PCB-Gerber-Datei \ n 2. BOM-Liste für PCBA \ n 3. Beispiel für PCB und PCBA \ n 4.Test-Methode für PCBA \ n \ n PCB-Vorlaufzeit: \ n \ n \ n

	Single/double side	4 layer	6 layer	Above 8 layer	HDI
Sample lead time(Normal)	5-6	6-7	7-8	10-12	15-20
Sample lead time(Fastest)	48-72 hours	5	6	6-7	12
Mass production lead time(First batch)	7-9	10-12	13-15	16	20

\ n produktbezogene \ n \ n \ n \ n \ n \ n \ n \ n \ n Ansicht unserer Werkstatt \ n \ n \ n \ n

Produktgruppe : LED-Beleuchtung PCBA